“Just the right PIC – How advanced test concepts enable fast PIC wafer-level tests”
Explore our webinar recap on how to test optical and electrical functions of PICs efficiently, about the challenges of testing at wafer level and how advanced test solutions lead to higher overall yields.
Introduction
The expanding use of social networks, digital entertainment, cloud-computing, and the internet of things (IoT) is radically driving the expansion of data centers. As a consequence, we see the requirement for high bandwidth, low-latency, low power consumption, and optical fiber-based communications.
Photonics plays a key role here as optical transceivers are the essential components in optical communication, along with fiber optics as the transmission medium. The core of such transceivers is the photonic integrated circuit (PIC), the high-performance chip of the future.
Learn from guest speaker Dr. Sylwester Latkowski, specialist for Photonic Integration from Eindhoven University of Technology (TU/e), how PICs are tested and what the challenges are in functional testing at wafer-level.
Jenoptik's expert Tobias Gnausch explained how to minimize testing times in high-volume production and increase your overall yield – using Jenoptik’s novel UFO® Probe Card!
Webinar recording
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Any questions?
We hope you enjoyed the webinar content and discussion. As not all questions could be answered in the limited time frame, we would like to invite you to discuss any questions, current or future projects and applications directly with our expert.
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